Presentation
Liquid Cooling for Eco-Friendly AI Factories
DescriptionThe current and next generation of high-performance CPUs and GPUs required to meet the demanding needs of AI and machine learning will generate a significant amount of heat, creating enormous challenges for hyperscalers already struggling to control their heat, energy consumption and footprint. With GPUs surpassing the 2,800 watt range, traditional air cooling methods have reached their limits, making way for innovative liquid cooling solutions such as immersive and direct-to-chip. This Exhibitor Forum presentation will provide an overview of two-phase direct-to-chip liquid cooling, highlighting how this technology can not only enhance the performance and reliability of high-performance AI servers, but also significantly contribute to sustainable data center operations and the industry-wide march towards net-zero carbon emissions. A case study of using a two-phase direct-to-chip monolithic cold plate designed to cool GB200 will be introduced.